- 介绍
Features
• Higher DC bias current and lower DCR
• Low profile and thin thickness
• Monolithic structure for high reliability
• Excellent solderability and high heat resistance
• No cross coupling due to magnetic shield
Application
• Notebooks and Tablets Devices
• Smartphones, Wearable devices
• Communication Devices
请选择你需要的尺寸
Please choose the size which you need
留言成功!